ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,858, issued on Nov. 3, was assigned to Advanced Micro Devices Inc. (Santa Clara, Calif.). "Semiconductor device with an embedded active devi... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,859, issued on Nov. 3, was assigned to INTEL FOUNDRY IP LLC (Santa Clara, Calif.). "Three-dimensional stack cooling wings" was invented by S... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,860, issued on Nov. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package on package structure with enc... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,861, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.). "Memory on package (MOP) architecture" was invented by Eng Huat Go... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,862, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Zigzag wired memory module" was invented by Jo... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,863, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.). "Microelectronic assemblies including stacked dies coupled by a th... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,864, issued on Nov. 3, was assigned to Altera Corp. (San Jose, Calif.). "Grid-based interconnect system for modular integrated circuit syste... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,865, issued on Nov. 3, was assigned to NEPES LAWEH Corp. (Cheongju-si, South Korea) and NEPES HAYYIM (Binan, Philippines). "Semiconductor pa... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,866, issued on Nov. 3, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan). "Semiconductor package" was invented by ... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,867, issued on Nov. 3, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China). "Chip structure and chip preparation method" was inv... Read More